SILICONE RESIN COMPOSITION, SILICON RESIN CURED ARTICLE AND OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATED BODY

摘要

PROBLEM TO BE SOLVED: To provide a silicon resin composition excellent in interfacial adhesiveness and heat resistance, a silicon resin cured article using the silicon resin composition and an optical semiconductor element encapsulated body.SOLUTION: There is provided a silicon resin composition containing a silicon resin mixture and an adhesiveness adding agent, which is a linear siloxane compound and has at least one of a group represented by the formula (2) or a group forming a heterocycle by an ether group to which 2 carbonyl groups represented by the formula (2) directly bound on both terminals or a silane atom on the chain.SELECTED DRAWING: None