发明名称 |
SEMICONDUCTOR DEVICE ASSEMBLY WITH UNDERFILL CONTAINMENT CAVITY |
摘要 |
Semiconductor device assemblies with underfill containment cavities are disclosed herein. In one embodiment, a semiconductor device assembly can include a first semiconductor die having a base region formed from a substrate material, a recessed surface along the base region, a peripheral region formed from the substrate material and projecting from the base region, and a sidewall surface along the peripheral region and defining a cavity with the sidewall surface in the peripheral region. The semiconductor device assembly further includes a thermal transfer structure attached to the peripheral region of the first die adjacent the cavity, and an underfill material at least partially filling the cavity and including a fillet between the peripheral region and the stack of second semiconductor dies. |
申请公布号 |
WO2016140865(A1) |
申请公布日期 |
2016.09.09 |
申请号 |
WO2016US19601 |
申请日期 |
2016.02.25 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
CHANDOLU, Anilkumar;HUANG, Wayne, H.;VADHAVKAR, Sameer, S. |
分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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