| 摘要 |
The invention relates to a method for sealing a substrate having one or a number of electrically conductive surface regions, comprising the (i) arranging of a sealing membrane, having a plastic layer and an outer adhesive layer made of a melt adhesive, on the substrate, wherein the adhesive layer is facing towards the substrate, (ii) the positioning of an induction heating device over the sealing membrane, and (iii) heating the melt adhesive for the fusion or partial melting thereof by means of the inductive heating of the electrically conductive surface regions with the induction heating device, in order to adhere the sealing membrane to the substrate after cooling. The method facilitates the sealing of substrates with sealing membranes. Same is suitable, in particular, for sealing floors or ceilings or parts thereof. |
