| 摘要 |
PROBLEM TO BE SOLVED: To provide a holding apparatus having advantage in improvement in flatness of a substrate.SOLUTION: There is provided a holding apparatus for holding a substrate comprising: a plurality of adhesion parts to which backside of the substrate is respectively adhered; a cylinder part which comprises a plurality of cylinders respectively arranged on the plurality of adhesion parts and which provides force with the plurality of adhesion parts via the plurality of cylinders so that the plurality of adhesion part are respectively moved in height direction by flowing fluid in the plurality of cylinders; a pressurization part comprising a reference plane as a reference of a configuration of a surface of the substrate and pressurizing the surface by jetting gas from the reference plane onto the surface; a controlling part which executes a process of making the surface follow the reference plane while pressurizing the surface by the pressurization part by moving respective of the plurality of adhesion part in height direction by the cylinder part so that the surface comes close to the reference plane.SELECTED DRAWING: Figure 2 |
