| 摘要 |
A method for producing a semiconductor light-emitting device comprising a substrate, an element and an encapsulating material as constituent members, comprising a first step of providing the substrate with the element;
a second step of at least one encapsulating material (i) before curing selected from the group consisting of addition polymerization-type encapsulating materials and
polycondensation-type encapsulating materials onto the substrate to cover the element;
a third step of curing the potted encapsulating material (i) before curing; and
a fourth step of potting a polycondensation-type encapsulating material (ii) before curing onto the encapsulating material (i) after curing which covers the element, and then curing the potted polycondensation-type encapsulating material (ii) before curing, thereby laminating the encapsulating material,
and
a semiconductor light-emitting device produced by the producing method, wherein two or more layers each comprising the encapsulating material are laminated. |
