| 发明名称 |
PROCESS FOR FLIP-CHIP CONNECTION OF AN ELECTRONIC COMPONENT |
| 摘要 |
The invention relates to a process for flip-chip connection of an electronic component (D) to a substrate (B), characterized in that it comprises producing at least one interconnect pad (PC) by etching a thick conductive film and bonding it, by means of at least one conductive adhesive, between a receiving pad or area of said electronic component and a receiving pad or area (PAS) of said substrate. |
| 申请公布号 |
EP2684434(B1) |
申请公布日期 |
2016.12.28 |
| 申请号 |
EP20120708973 |
申请日期 |
2012.03.06 |
| 申请人 |
Commissariat à l'Énergie Atomique et aux Énergies Alternatives;3D Plus |
发明人 |
LIMOUSIN, Olivier;SOUFFLET, Fabrice |
| 分类号 |
H05K3/32;H01L21/60;H01L23/00;H05K3/02;H05K3/06;H05K3/12;H05K3/40 |
主分类号 |
H05K3/32 |
| 代理机构 |
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