| 摘要 |
PROBLEM TO BE SOLVED: To identify positions of multiple dies surrounded by a grip ring.SOLUTION: A grip ring for gripping a wafer sheet on which a plurality of dies are arranged is provided. The grip ring includes a ring portion arranged so as to surround the plurality of dies when grasping the wafer sheet. A plurality of pieces of first position identification information is attached to the surface of the ring portion at intervals in predetermined positions in a circumferential direction. Each of the plurality of pieces of first position identification information can be distinguished from the other first position identification information. The position in the circumferential direction to which the first identification information is attached can be identified from the identification information.SELECTED DRAWING: Figure 2 |
