THROUGH ELECTRODE SUBSTRATE, AND INTERPOSER AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a highly-reliable through electrode substrate and a method of manufacturing the same.SOLUTION: Provided is a through electrode substrate comprising: a substrate that has a first surface and a second surface opposed to the first surface; a through hole that penetrates through the first surface and the second surface, and that has a shape having a major axis and a minor axis in a plan view; and a through electrode arranged at the through hole, and that electrically connects between wiring arranged at the first surface side and wiring arranged at the second surface side. An aspect ratio of a depth of the through hole to the major axis of the through hole is equal to or less than 4.SELECTED DRAWING: Figure 3