| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu bonding wire having a Pd coating layer on the surface, being suitable for an on-vehicle device by improving the reliability of junction of a ball joint part in a high-temperature and high-humidity environment.SOLUTION: A bonding wire for semiconductor device comprising a Cu alloy core material and a Pd coating layer formed on the surface of the Cu alloy core material is characterized in that it includes at least one element selected from Sn, Sb, Bi and Se, and the concentration of the selected element or elements is 0.1 to 100 mass ppm in total, and Sn is ≤10 mass ppm, Sb is ≤10 mass ppm and Bi is ≤1 mass ppm.SELECTED DRAWING: None |
