| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic module with at least one component embedded in an insulating material.SOLUTION: An electronic module comprises: a first insulating material 106 having a first surface 118, a second surface 119, and a thickness between the first surface and the second surface; at least one opening through the first insulating material; a second insulating material 111 on the second surface of the first insulating material; at least one component 108 embedded in the second insulating material; at least one conductive pattern 115 which includes a first surface 120 and a second surface 121 in the at least one opening and in which the second surface faces the second insulating material, the first surface is separated from the second insulating material, and the distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is shorter than or longer than the thickness of the first insulating material; an adhesive 107 between the first insulating material and the at least one component; and a connection element between the at least one conductive pattern and the at least one component.SELECTED DRAWING: Figure 29 |
