ADDITIONAL CURABLE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an additional curable silicone composition that gives a cured product having excellent low-temperature properties and excellent temperature change resistance, and a highly-reliable semiconductor device having a semiconductor element sealed with a cured product of the composition.SOLUTION: An additional curable silicone composition comprises (A) branched organopolysiloxane having at least one alkenyl group and at least one hydrosilyl group in one molecule and (B) hydrosilylation catalyst in a catalyst amount.SELECTED DRAWING: None