| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate liquid processing apparatus (substrate liquid processing method) capable of etching a coat, formed on the surface of a substrate, well.SOLUTION: A substrate liquid processing apparatus has a liquid processing section (38) for processing a coat, formed on the surface of a substrate (8), with an etching liquid, an etching liquid supply section (39) for supplying an etching liquid to the liquid processing section (38), and a control section (7) for controlling the etching liquid supply section (39). The control section (7) controls to etch the substrate (8) in the liquid processing section (38) by supplying the etching liquid, in a state of low etching rate for the coat, from the etching liquid supply section (39) to the liquid processing section (38), thereafter to etch the substrate (8) in the liquid processing section (38) by supplying the etching liquid, in a state of high etching rate for the coat, from the etching liquid supply section (39) to the liquid processing section (38).SELECTED DRAWING: Figure 5 |
