发明名称 HEATING-COOLING METHOD AND HEATING-COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heating-cooling method for efficiently defoaming, then heating for thermally curing, cooling and taking out an uncured thermosetting resin having high viscosity, and also to provide a heating-cooling device.SOLUTION: A heating-cooling device 100 includes: a processing chamber 4 having airtightness; a vacuum exhaust device 8 for evacuation; a gas supply device 15; an induction heating coil 2a and an infrared lamp 2c; a cooling device 3; and a moving device 10 which changes a distance between a member 1 to be processed and a cooling part 3a. A heat input amount is controlled by increasing/decreasing output of the induction heating coil 2a and the infrared lamp 2b, and a heat radiation amount of the member 1 to be processed is controlled by increasing/decreasing pressure of the processing chamber 4, and the distance between the member 1 to be processed and the cooling part 3a.SELECTED DRAWING: Figure 1
申请公布号 JP2016219509(A) 申请公布日期 2016.12.22
申请号 JP20150100307 申请日期 2015.05.15
申请人 FUJI ELECTRIC CO LTD 发明人 NAKAHARA HIROAKI;WADA TAKENORI;MATSUSHITA TAKESHI;IGARASHI YOSHIO
分类号 H01L21/56;H01L23/29;H01L25/07;H01L25/18 主分类号 H01L21/56
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