摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component that is able to prevent occurrence of short circuit between terminal electrodes even in a case where solder joining a terminal electrode and a lead terminal are joined is remelted.SOLUTION: An electronic component EC1 comprises: an element assembly EB, one pair of terminal electrodes 5, an insulating resin layer 17, and external resin 31. The element assembly EB is rectangular parallelepiped and has one pair of end faces 1 and four side faces 2, 3. The one pair of terminal electrodes 5 have an electrode portions 5a formed on end faces 1 and electrode portions 5b formed on the four side faces 2, 3. The insulation resin layer 17 entirely covers the electrode portions 5a, and the areas of the four side faces 2, 3, which areas are exposed from the electrode portions 5b. The external resin 31 covers: one pair of lead terminals 21 joined to the corresponding electrode portions 5a exposed from the insulation resin layer 17 by solder S; the insulation resin layer 17; the solder S; and part of each lead terminal 21.SELECTED DRAWING: Figure 1 |