PREPREG, RESIN SUBSTRATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a prepreg, a resin substrate, a metal-clad laminate and a printed wiring board that can achieve a semiconductor device having reduced warpage and improved connection reliability, and provide such a semiconductor device having reduced warpage and improved connection reliability.SOLUTION: A prepreg is used for forming an insulating layer in a printed wiring board, and is obtained by impregnating a fiber base material with a thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and a (meth) acrylic block copolymer.SELECTED DRAWING: None