| 摘要 |
PROBLEM TO BE SOLVED: To provide: a lead frame or substrate for an optical semiconductor device, which is easy to maintain a light emission efficiency at a high level, and superior in wire bondability; or an optical semiconductor device using such a lead frame or substrate.SOLUTION: A lead frame (100) for an optical semiconductor device according to one embodiment of the present invention comprises, on a base (10), a nickel or nickel alloy-plated layer (11) having a thickness of 0.5 to 7 μm, a rhodium or rhodium alloy-plated layer (12) having a thickness of 0.01 to 0.1 μm, and a gold-plated layer (13) arranged so that bis -4.0 to 10.0 in Labcolor system display, or x is 0.297 to 0.327, and y is 0.305 to 0.360 in chromaticity xy display, in this order.SELECTED DRAWING: Figure 1 |
