发明名称 System and Method for Monitoring Parameters of a Semiconductor Factory Automation System
摘要 A system for monitoring one or more conditions of an automation system of a semiconductor factory includes one or more instrumented substrates, one or more sealable containers and one or more system servers. The one or more instrumented substrates include one or more sensors. The one or more sensors measure one or more conditions of the one or more instrumented substrates as the one or more sealable containers transport the one or more instrumented substrates through the semiconductor factory. The one or more sealable containers also receive sensor data from the one or more sensors included on the one or more instrumented substrates. The one or more system servers are configured to receive the sensor data from the one or more sealable containers. The one or more servers are configured to identify one or more deviations in the measured one or more conditions.
申请公布号 US2016370797(A1) 申请公布日期 2016.12.22
申请号 US201615048676 申请日期 2016.02.19
申请人 KLA-Tencor Corporation 发明人 Azarya Mor;Brain Michael D.;Appelbaum Ami;Mark Shai;Hoffman Arie
分类号 G05B19/418 主分类号 G05B19/418
代理机构 代理人
主权项 1. A system for monitoring one or more conditions of an automation system of a semiconductor factory comprising: one or more instrumented substrates, wherein the one or more instrumented substrates include one or more sensors, wherein the one or more sensors are configured to measure one or more conditions of the one or more instrumented substrates as the one or more instrumented substrates traverse one or more portions of the semiconductor factory, wherein the one or more instrumented substrates include substrate communication circuitry and one or more processors communicatively coupled to the one or more sensors and the substrate communication circuitry; one or more sealable containers configured to transport the one or more instrumented substrates through the semiconductor factory, wherein the one or more sealable containers include container communication circuitry, wherein the container communication circuitry is communicatively couplable to the substrate communication circuitry, wherein the container communication circuitry is configured to receive sensor data from the one or more sensors of the one or more instrumented substrates via the substrate communication circuitry; and one or more system servers, wherein the one or more system servers include server communication circuitry, wherein the server communication circuitry is communicatively couplable to the one or more sealable containers, wherein the server communication circuitry is configured to receive the sensor data from the container communication circuitry, wherein the one or more system servers are configured to identify one or more deviations in the measured one or more conditions of the one or more instrumented substrates.
地址 Milpitas CA US