发明名称 MEMS Devices and Methods for Forming Same
摘要 An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.
申请公布号 US2016368762(A1) 申请公布日期 2016.12.22
申请号 US201615160884 申请日期 2016.05.20
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Cheng Chun-Wen;Peng Jung-Huei;Tsai Shang-Ying;Tsai Hung-Chia;Teng Yi-Chuan
分类号 B81B7/00;B81C1/00 主分类号 B81B7/00
代理机构 代理人
主权项 1. A microelectromechanical systems (MEMS) device, comprising: a first MEMS die having a first substrate and a first cavity, the first cavity having a first pressure; a second MEMS die having a second substrate and a second cavity, the second cavity having a second pressure, the second pressure being different from the first pressure, the first substrate being physically separate from the second substrate; a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first MEMS die and the second MEMS die; a second set of electrical connectors over the first surface of the molding material; and a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first MEMS die and the second MEMS die to one electrical connector of the second set of electrical connectors.
地址 Hsin-Chu TW