| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an abrasive composition that can produce a substrate of excellent surface roughness at a high polishing rate. <P>SOLUTION: The abrasive composition contains at least one kind selected out of a group consisting of tungstate such as ammonium paratungstate, ammonium metatungstate, potassium tungstate or calcium tungstate; tungsten-based heteropolyacid such as tungstic acid, phosphotungstic acid, tungstosilicic acid or phosphotungstomolybdic acid; tungsten-based heteropolyacid salt; molybdenum-based heteropolyacid such as molybdic acid, molybdate, phosphomolybdic acid or phosphotungstomolybdic acid; and molybdenum-based heteropolyacid salt. The abrasive composition further contains an oxygen carrier such as hydrogen peroxide, abrasive grains, a pH regulator and water. A silicon carbide substrate, for instance, can be efficiently polished using this abrasive composition. <P>COPYRIGHT: (C)2011,JPO&INPIT |
