发明名称 半導体装置
摘要 A semiconductor device includes a semiconductor substrate of a first conductivity type, a first region of a second conductivity type formed in the semiconductor substrate, a second region of the first conductivity type formed in the first region, a source region of the second conductivity type formed in the second region, a drain region of the second conductivity type formed in the first region, a first junction part including a part of a border between the first region and the second region, which is on the side of the drain region, a second junction part including a part of the border between the first region and the second region, which is at a location different from the first junction part, a gate electrode formed above the first junction, and a conductor pattern formed above the second junction part and being electrically independent from the gate electrode.
申请公布号 JP5983122(B2) 申请公布日期 2016.08.31
申请号 JP20120158405 申请日期 2012.07.17
申请人 富士通セミコンダクター株式会社 发明人 小野田 道広
分类号 H01L21/336;H01L21/8234;H01L27/088;H01L29/78 主分类号 H01L21/336
代理机构 代理人
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