发明名称 |
WIRING BODY, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BODY |
摘要 |
PROBLEM TO BE SOLVED: To provide a wiring body capable of enhancing adhesiveness between a supporting material for supporting the wiring body and first or second conductor wires.SOLUTION: A wiring body 3 includes: a resin layer 33; first conductor wires 321 and 322 embedded with one side of the resin layer 33; and second conductor wires 341 and 342 embedded with the other side of the resin layer 33. Surface roughness of a first surface in one side of the first conductor wires 321 and 322 is rougher than surface roughness of a second surface except the first surface in the first conductor wires 321 and 322. Surface roughness of a third surface in the other side of the second conductor wires 341 and 342 is rougher than surface roughness of a fourth surface except the third surface in the second conductor wires.SELECTED DRAWING: Figure 2 |
申请公布号 |
JP2016157741(A) |
申请公布日期 |
2016.09.01 |
申请号 |
JP20150032987 |
申请日期 |
2015.02.23 |
申请人 |
FUJIKURA LTD |
发明人 |
NITTA YOSUKE |
分类号 |
H05K3/38;H01B1/20;H01B5/14;H01B13/00;H05K3/10;H05K3/20 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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