发明名称 WIRING BODY, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BODY
摘要 PROBLEM TO BE SOLVED: To provide a wiring body capable of enhancing adhesiveness between a supporting material for supporting the wiring body and first or second conductor wires.SOLUTION: A wiring body 3 includes: a resin layer 33; first conductor wires 321 and 322 embedded with one side of the resin layer 33; and second conductor wires 341 and 342 embedded with the other side of the resin layer 33. Surface roughness of a first surface in one side of the first conductor wires 321 and 322 is rougher than surface roughness of a second surface except the first surface in the first conductor wires 321 and 322. Surface roughness of a third surface in the other side of the second conductor wires 341 and 342 is rougher than surface roughness of a fourth surface except the third surface in the second conductor wires.SELECTED DRAWING: Figure 2
申请公布号 JP2016157741(A) 申请公布日期 2016.09.01
申请号 JP20150032987 申请日期 2015.02.23
申请人 FUJIKURA LTD 发明人 NITTA YOSUKE
分类号 H05K3/38;H01B1/20;H01B5/14;H01B13/00;H05K3/10;H05K3/20 主分类号 H05K3/38
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