发明名称 Communication device with ground plane antenna
摘要 A communication device including a ground element, a dielectric substrate, and an antenna element is provided. The dielectric substrate is disposed nearby the ground element and has a first surface and a second surface. The antenna element includes a first metal portion and a second metal portion. The first metal portion is disposed on the first surface and has a feeding point. The second metal portion is disposed on the second surface. The first metal portion is electrically connected to the second metal portion through a conductive via-hole, and the conductive via-hole is located at or nearby a first edge of the first metal portion. The first edge is away from the ground element. The projection of the second metal portion on the first surface is covered by the first metal portion.
申请公布号 US9431696(B2) 申请公布日期 2016.08.30
申请号 US201313949245 申请日期 2013.07.24
申请人 Acer Incorporated 发明人 Wong Kin-Lu;Weng Tseng-Wei
分类号 H01Q1/38;H01Q1/48;H01Q9/26;H01Q1/24;H01Q9/04;H01Q5/364 主分类号 H01Q1/38
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A communication device, comprising: a ground element; a dielectric substrate, disposed nearby the ground element, the dielectric substrate having a first surface and a second surface; and an antenna element, consisting essentially of a first metal portion and a second metal portion, wherein the antenna element and the ground element form a ground plane antenna, a feeding point is disposed on the first metal portion, the first metal portion is disposed on the first surface, the second metal portion is disposed on the second surface, the first metal portion is electrically connected to the second metal portion through a conductive via-hole, wherein the first metal portion comprises a first edge away from the ground element and a second edge nearby the ground element, a first end of a diagonal of the first metal portion connects an end of the first edge, and a second end of the diagonal of the first metal portion connects an end of the second edge, wherein the feeding point is nearby the second end of the diagonal of the first metal portion and the conductive via-hole is nearby the first end of the diagonal of the first metal portion, such that a surface current flowing through the first metal portion electrically connected to the second metal portion is distributed more uniformly than that of the first metal portion which is not electrically connected to the second metal portion, and a projection of e second metal portion on the first surface is covered by the first metal portion, wherein a shape of the first metal portion is an inverted U shape and the first edge is an edge of a middle section of the inverted U shape, and the conductive via-hole is located at or nearby a corner of the second metal portion.
地址 New Taipei TW