| 摘要 |
PROBLEM TO BE SOLVED: To allow for soldering of a land and a wire without damaging the resin wall around the land, in a board including a land surrounded by a resin wall.SOLUTION: In a board 4 including a land 5 to which the end 2a of a magnet wire 2 is soldered, and a resin wall 7 formed higher than the land 5 around the land 5, the resin wall 7 has an inclined plane 7a inclining with respect to the land 5 at an angle larger than 90 degrees.SELECTED DRAWING: Figure 2 |
