| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor component which enables wiring from an exterior part to be connected to an electrode at a part on a lamination facing surface formed by semiconductor elements, which are laminated facing each other, and prevents migration and cracks etc. from occurring in the electrode on the lamination facing surface through which a relatively large current flows, and to provide a manufacturing method of the semiconductor component.SOLUTION: A first electrode 10S, a second electrode 10G, and a protection layer 10H are formed on a first surface of a first semiconductor element 10A. The protection layer is formed in at least one of a part around the first electrode and a part around the second electrode so as to be located above the first electrode and the second electrode. An element electrode 23D and an extraction electrode 20G are formed on a second surface of the second semiconductor element 20. Conductive projection parts 10T, 11T having flat surfaces 10M, 11M at tips are formed in at least one of the first electrode and the element electrode and at least one of the second electrode and the extraction electrode. The first electrode is connected to the element electrode through the projection part and the second electrode is connected to the extraction electrode through the projection part.SELECTED DRAWING: Figure 14 |
