| 摘要 |
PROBLEM TO BE SOLVED: To improve a yield by preventing a housing from being deformed at heating.SOLUTION: A manufacturing method of a light-emitting device comprising a resin housing 10 having an upper surface, a lower surface, and a pair of side surfaces; and a pair of metal lead electrodes 20 that is electrically and physically connected to an electrode of a light emitter at one end part being exposed in a concave part 12, and is exposed to an outer part of the housing 10 at the other end part, the method comprises steps of: preparing a lead frame having a part to be a pair of lead electrodes 20 and a part to be a pair of hanger leads; molding the housing 10 to the lead frame by embedding the part to be the lead electrode 20 in a contacting state to the part to be the hanger lead; separating the lead frame and the part to be the lead electrode 20; and flip-chip mounting the light emitter to the lead electrode 20 in the concave part 12 in a state that the housing 10 is held to the lead frame by the pair of hanger leads, in this order.SELECTED DRAWING: Figure 1 |
