| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method which enables the increase in throughput without the need for increasing the footprint of a substrate processing apparatus.SOLUTION: A substrate processing method for performing processes on substrates in a substrate processing apparatus including an indexer section, a processing section and an interface section comprises the steps of: performing processes (S2a-S11a, and S2b-S11b) for forming a resist film on each substrate in floors provided in the processing section in parallel; and performing development processes (S17a-S20a, and S17b-S20b) on the substrates in the floors provided in the processing section in parallel.SELECTED DRAWING: Figure 11 |
