发明名称 |
ELECTRONIC DEVICE AND ELECTRONIC PACKAGE THEREOF |
摘要 |
An electronic package is provided, including a substrate and a semiconductor chip. The substrate has a plurality of substrate pads. The semiconductor chip is mounted on the substrate, wherein the semiconductor chip includes a plurality of chip pads electrically connected to the substrate pads of the substrate respectively, and the substrate pads and the chip pads are both trapezoidal. |
申请公布号 |
EP3065171(A3) |
申请公布日期 |
2016.12.21 |
申请号 |
EP20150159632 |
申请日期 |
2015.03.18 |
申请人 |
Delta Electronics, Inc. |
发明人 |
Lin, Shiau Shi;Lee, Chia-Yen;Tsai, Hsin-Chang |
分类号 |
H01L23/485;H01L23/367;H01L23/498 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|