发明名称 |
IMAGE SENSORS WITH CONTAMINATION BARRIER STRUCTURES |
摘要 |
An image sensor package including a barrier structure to prevent image sensor die contamination is described. A barrier structure may surround an image sensor die that is attached on an image sensor carrier. The barrier structure may be attached to a transparent window structure as well as a package substrate. The barrier structure may extend through a hole in the package substrate. The image sensor carrier may be mounted to the package substrate using a thermal compression head that is able to apply independently varying compressive forces to corresponding regions of a surface at a given time. The thermal compression head may be used to cure the barrier structure and/or adhesives used in the image sensor package. Underfill adhesive may be deposited between discrete mounting structures used to mount the package substrate to the image sensor carrier, after the barrier structure has been applied. |
申请公布号 |
US2016268325(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
US201514644456 |
申请日期 |
2015.03.11 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
HSIEH Yu-Te;WU Weng-Jin |
分类号 |
H01L27/146;H04N5/225 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
|
主权项 |
1. An image sensor package, comprising:
an image sensor carrier; an image sensor die attached to the image sensor carrier; and a barrier structure that surrounds the image sensor die. |
地址 |
Phoenix AZ US |