FAN-OUT POP STACKING PROCESS

摘要

Package on package structures and manners of formation are described. In an embodiment, an array of trenches is formed partially through a fan-out substrate. In an embodiment, a plurality of laterally separate locations thermal interface material is dispensed onto an array of embedded bottom die. In an embodiment a thermal compression tool including an array of cavities corresponding to an array of top packages is brought into contact with the array of top packages and underlying fan-out substrate during PoP joint formation. The fan-out substrate may be secured to a vacuum chuck during several processing operations.

主权项

1. A method of forming a semiconductor device package comprising:
forming an array of trenches partially through an active side of a fan-out substrate, wherein a second side of the fan-out substrate opposite the active side is supported by a carrier substrate during forming the array of trenches, and the fan-out substrate further comprises:
a plurality of embedded bottom die on the carrier substrate and embedded within a polymer-based molding compound; anda redistribution layer spanning over the polymer-based molding compound and the plurality of embedded bottom die, wherein the redistribution layer includes a plurality of conductive lines that fan-out electrical connections with the plurality of embedded bottom die; removing the carrier substrate; and placing an array of top packages onto the second side the fan-out substrate.