发明名称 スパッタ装置および成膜装置
摘要 This sputtering device has a space-defining member for defining a sputtering space in which to form a film on a substrate. The space-defining member has a recess, and the bottom of the recess is provided with an opening. The sputtering device is provided with a shielding member for shielding the opening from the sputtering space. The opening is formed such that it is possible to attach a pressure gauge capable of measuring the pressure inside the sputtering space, and the shielding member is arranged so as to be at least partially embedded within the recess.
申请公布号 JP6046871(B2) 申请公布日期 2016.12.21
申请号 JP20160536796 申请日期 2015.07.31
申请人 キヤノンアネルバ株式会社 发明人 廣見 太一;下川 英利;市川 篤行
分类号 C23C14/34;H01L21/203 主分类号 C23C14/34
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