| 摘要 |
PROBLEM TO BE SOLVED: To effectively suppress electrostatic breakdown with an inexpensive constitution, irrespective of a type of a wafer.SOLUTION: A wafer holding apparatus (2) holds a wafer (W) supported via an adhesive tape (92) to an inner side of an annular frame (93), and includes a holding table (71) including a holding face (711) holding the wafer (W) via the adhesive tape (92), and suction holes (713) formed at a plurality of places on an outer peripheral side of the holding face (711). Fine irregularities are formed on the holding face (711) so that a contact face with the adhesive tape (92) becomes a rough face. |
