| 摘要 |
PROBLEM TO BE SOLVED: To provide an aluminum wiring material for bonding, such as an Al ribbon and an Al wire, which is used in joining a board and an electronic component embedded in various devices or the like using a semiconductor, is excellent in joint strength, has stable bonding properties, and is uniform in quality.SOLUTION: An aluminum wiring material for bonding contains 800 ppm or less of one or more of Ni, Si and P, in total, with the balance consisting of Al excluding an element inevitably contained therein, and has an average crystal grain size of 3 μm or more and 180 μm or less, a surface roughness (Ra) of 2 μm or less, and a thickness of an oxide film on a surface thereof of 5 nm or less. The aluminum wiring material is subjected to surface treatment using a surface treatment agent.SELECTED DRAWING: Figure 1 |
