发明名称 非接触式ICカード用又は非接触式ICタグ用の回路基板及び非接触式ICカード又は非接触式ICタグ
摘要 PROBLEM TO BE SOLVED: To provide a circuit board for a non-contact type IC card or a non-contact type IC tag, and the like on which any one selected from two kinds of IC chips or more different in bump positions and internal capacitance can be optionally mounted, and further, which can obtain a resonant frequency optimum for communication operation to be performed by each IC chip.SOLUTION: The circuit board for the non-contact type IC card or the non-contact IC tag includes: an insulation substrate; an antenna circuit; a confronting terminal section that is parallely arranged at a part of the antenna circuit, and corresponds to bump positions of two types of IC chips or more; and a capacitor pattern section that is disposed in parallel with the confronting terminal section at the part of the antenna. The capacitor pattern section includes: a conductive tape that is disposed on one surface side of the insulation substrate; and one piece of a plane surface pattern B that is disposed on the other surface side of the insulation substrate so as to overlap the conductive tape on the one surface side thereof, when viewed in a plane view.
申请公布号 JP6048740(B2) 申请公布日期 2016.12.21
申请号 JP20130021308 申请日期 2013.02.06
申请人 日立化成株式会社 发明人 木瀬 喜隆;田崎 耕司;菅野 雅雄;成瀬 健三
分类号 G06K19/07;B42D25/305;G06K19/077;H01Q1/38 主分类号 G06K19/07
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