| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in wiring board capable of improving the reliability of a built-in electronic component.SOLUTION: An electronic component built-in wiring board comprises: an insulating base material including a wiring circuit pattern including a thermosetting resin and formed on at least one surface thereof, and a via hole conductor 3 composed of a plating layer electrically connected to the wiring circuit pattern; and an electronic component 4 which is embedded in the insulating base material and includes a ceramic body 5 and an external electrode 6 provided in a part of the ceramic body 5, and in which the external electrode 6 is connected to the via hole conductor 3. The external electrode 6 includes a base electrode 6a, a nickel plating layer 6b1 covering the base electrode 6a, and a copper plating layer 6b2 covering the nickel plating layer 6b1. The copper plating layer 6b2 includes a region 7 a part of which has been subjected to etching treatment, and is connected to the via hole conductor 3 in the region 7.SELECTED DRAWING: Figure 3 |
