METHOD AND DEVICE FOR DETECTING CURRENT MAGNETIC FIELD DISTRIBUTION AMONG BONDING WIRES OF POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method and device for accurately and rapidly detecting bonding wire defects in a low-cost and contactless manner by measuring distribution of currents flowing through a plurality of bonding wires of a power semiconductor device without having to apply significant modification to wiring length and electrode layout of testing electrical circuitry that notably affects power semiconductor device pulse switching tests done by conventional power semiconductor device test apparatuses.SOLUTION: A device for detecting current magnetic field distribution among bonding wires of a power semiconductor 1 comprising a plurality of power semiconductor devices whose substrates are interconnected via multiple bonding wires 7, 8 is disclosed, including; a plurality of current sensors 10 for individually detecting currents flowing through the multiple bonding wires 7, 8; means of measuring current, for each bonding wire, at a measurement target point and at least one offset point away from the measurement target point using the current sensors 10; and means of computing differences between currents measured at the measurement target points and currents measured at the offset points.SELECTED DRAWING: Figure 2