Electronic component and method for electrically coupling a semiconductor die to a contact pad

摘要

In an embodiment, an electronic component includes a dielectric core layer, one or semiconductor dies comprising a first major surface, a first electrode arranged on the first major surface and a second major surface that opposes the first major surface. One or more slots are arranged within the dielectric core layer adjacent the semiconductor die and a redistribution structure electrically couples the first electrode to a component contact pad arranged adjacent the second major surface of the semiconductor die. The semiconductor die is embedded in the dielectric core layer and a portion of the redistribution structure is arranged on side walls of the slot.

主权项

1. An electronic component, comprising:
a dielectric core layer; one or semiconductor die comprising a first major surface, a first electrode arranged on the first major surface and a second major surface that opposes the first major surface, wherein the semiconductor die is embedded in the dielectric core layer; one or more slots arranged within the dielectric core layer adjacent the semiconductor die, and a redistribution structure electrically coupling the first electrode to a first component contact pad arranged adjacent the second major surface of the semiconductor die, wherein a portion of the redistribution structure is arranged on side walls of the slot, wherein the first electrode is first current electrode and the semiconductor die further comprises a second current electrode arranged on the second major surface and a control electrode.