| 摘要 |
The invention relates to flux for dip soldering. The flux has excellent wetting property and is capable of preventing generation of solder balls. The flux for dip soldering comprises polyaleneglycol (A) which intramolecularly has a repetitive unit composition represented by a formula: to (OR1) to with the hydroxyl value being 10 to 600, wherein the R1 represents one selected from ethylidene, propylidene, and isopropylidene. |
