| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer substrate which can facilitate the removal of a support substrate and improve the yield.SOLUTION: A method of manufacturing a wafer substrate comprises: a step of forming a bonding layer 13 which includes a bonding material 13a located between the wafer substrate and a support substrate 11 supporting the wafer substrate, and a gap portion 13b surrounded by at least one of the support substrate 11 and the wafer substrate 12, and the bonding material 13a to form a closed space while being continuous from a peripheral side to a center side of a bonding surface; a step of bonding the wafer substrate and the support substrate 11; and a step of opening the closed space of the gap portion 13b so as to remove the wafer substrate and the support substrate 11 from each other. |
