发明名称 スパッタ装置
摘要 PROBLEM TO BE SOLVED: To provide a sputtering device capable of preventing a film deposited on a holding jig from being exfoliated easily, and improving the operation rate by reducing a moisture amount adsorbed onto the holding jig, and to provide a production method of a solar cell.SOLUTION: A sputtering device has a constitution including a film deposition chamber in which a sputtering target is arranged, and a holding jig arranged in the film deposition chamber during a deposition process, for holding a substrate which is a film deposition object. In the holding jig, surface roughness of a face (34) facing to the sputtering target is greater than surface roughness of other faces (35, 36) exposed to a region where sputtering particles are scattered.
申请公布号 JP6048667(B2) 申请公布日期 2016.12.21
申请号 JP20130048997 申请日期 2013.03.12
申请人 パナソニックIPマネジメント株式会社 发明人 早田 博;長谷川 勲;藤嶋 大介;栄留 浩
分类号 C23C14/34;H01L31/18 主分类号 C23C14/34
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