发明名称 基板洗浄方法、基板洗浄装置及び真空処理システム
摘要 In order to remove a deposit adhered to the backside of the peripheral portion of a wafer, a cleaning gas containing carbon dioxide gas is set to a pressure that is slightly lower than the pressure corresponding to a vapor pressure line of carbon dioxide at a temperature in the nozzle, and a gas cluster of carbon dioxide is generated. A gas cluster of carbon dioxide generated under such a condition is in a state immediately prior to undergoing a phase change to a liquid and therefore is a gas cluster having a large cluster diameter and having molecules that are firmly solidified.
申请公布号 JP6048043(B2) 申请公布日期 2016.12.21
申请号 JP20120217539 申请日期 2012.09.28
申请人 東京エレクトロン株式会社 发明人 土橋 和也;井内 健介;斉藤 美佐子
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
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