| 摘要 |
PROBLEM TO BE SOLVED: To improve the bondability of a thermal oxide film and a second substrate.SOLUTION: After the step of forming a thermal oxide film 20 on a first substrate 10 with a dent 11 formed therein, a thermal oxide film adjustment step is carried out, in which, if the peripheral part of the opening of the dent part in a face 10a of the first substrate 10 is defined as a boundary area 12a, and an area larger than the boundary area 12a and surrounding the boundary area 12a is defined as a peripheral area 12b, the thickness of the portion formed in the boundary area 12a of the thermal oxide film 20 is made less than the thickness of a portion formed in the peripheral area 12b. Then, the portion formed in the peripheral area 12a of the thermal oxide film 20 is bonded to a second substrate 30. |
