RETAINER RING, SUBSTRATE HOLDING DEVICE, POLISHING DEVICE, AND MAINTENANCE METHOD OF RETAINER RING

摘要

PROBLEM TO BE SOLVED: To provide a substrate holding device which stabilizes a substrate polishing rate even when multiple substrates are sequentially polished.SOLUTION: A retainer ring (40) for a substrate holding device holds a substrate (W) and presses the substrate (W) to a polishing pad (2). The retainer ring (40) includes: an inner ring (40a) which is disposed so as to enclose the substrate (W); and an outer ring (40a) which is provided at the outer side of the inner ring (40a), has abrasion resistance higher than that of the inner ring (40a), and includes a protruding part (P) formed toward the polishing pad (2). A distance between an inner peripheral surface of the inner ring (40a) and the protruding part (P) ranges from 0.5 mm to 5 mm.SELECTED DRAWING: Figure 12