| 摘要 |
The invention provides a wiring forming device capable of forming the wiring pattern stably, a maintaining method, and a wiring forming method. The wiring forming device (1) is provided with an atomization device (2), a nozzle (3), and a connecting pipe (4) used for connecting the atomization device and the nozzle. The cataplasm materials atomized and sprayed by the nozzle (3) can be used for forming the wiring patterns on the substrate (W). The wiring forming device (1) is provided with a first gas supply part (61), which is used for providing first maintaining gas for the connecting pipe (4); an absorption part (63), which is used for the absorption of the connecting pipe (4); and a second gas supply part (65), which is used for providing second maintaining gas for the connecting pipe. The absorption in the connecting pipe (4) and the supply of the second maintaining gas can be carried out at the same time. Under the control, the idle time of the wiring forming can be used for the supply and the absorption of the first maintaining gas and the supply of the second maintaining gas, and therefore the forming of the wiring patterns can be formed, when the maintaining of the wiring forming device (1) is carried out. |
