| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation resin layer which has excellent heat conductivity and an excellent alleviation function of heat stress and is suitable for ensuring heat radiation performance and connection reliability in an electronic apparatus which is formed by connecting a mold package, where an island having an electronic component mounted on one surface is sealed by a mold resin and the other surface of the island is exposed from the mold resin, with a heat radiation member through the insulation resin layer.SOLUTION: A peripheral part of an insulation resin layer 3 protrudes from a shell of the other surface 12 of an island 10 to join a mold resin 30 to one surface 2a of a heat radiation member 2. The peripheral part of the insulation resin layer 3 is formed as a thick part 3a thicker than a portion of the insulation resin layer 3 which is positioned on the other surface 12 of the island 10. |
