| 摘要 |
Provided are an etching fluid that is capable of suppressing side etching while not impairing the linearity of copper wiring, a replenishing fluid for the same, and a method for forming copper wiring. This etching fluid is a copper etching fluid characterized in being an aqueous solution containing acid, oxidizing metal ions, and a compound (A), the compound (A) having in molecules thereof an amino group and at least one sulfur-containing functional group selected from the group consisting of thiole groups, sulfide groups, and disulfide groups (where the sulfide and disulfide groups are groups in which the sulfur atoms and the heteroatoms linked thereto are linked by a single bond, and which do not form &pgr; conjugates). |
