| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure which is suitable for preventing the damage caused by a mold for resin molding and the occurence of resin burrs on a heat radiation surface in a semiconductor device formed by providing a metal plate and a ceramic plate on both surface sides of a semiconductor element and sealing the semiconductor element by a mold resin.SOLUTION: A semiconductor device comprises: a pair of metal plates 20, 30 which are respectively joined to a one surface 11 side and an other surface 12 side of a semiconductor element 10 so as to enable electric and heat conduction and sandwich the semiconductor element 10; electric insulative ceramic plates 40, 50 which are provided on outer surfaces 21, 31 of the pair of metal plates 20, 30; and a mold resin 60 which seals the metal plates and the ceramic plates so as to enclose those plates. Outer surfaces 41, 51 of the ceramic plates 40, 50 are exposed from the mold resin 60. Interposition layers 110, 120 which are softer than the metal plates and the ceramic plates are disposed between the outer surfaces 21, 31 of the pair of metal plates 20, 30 and the inner surfaces 42, 52 of the ceramic plates. |
