| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus that has a high productivity and performs uniform deposition for a wafer.SOLUTION: A semiconductor manufacturing apparatus includes: a reaction chamber in which a substrate is housed; a gas supply part disposed on an upper portion of the reaction chamber and supplying a first process gas containing a source gas; a rectifying plate for supplying the first process gas onto the substrate in a rectified state; gas exhaust parts for exhausting residual gas in the reaction chamber; a heating part for heating the substrate; a supporting member for supporting the substrate; and a rotary drive mechanism for rotating the substrate. The semiconductor manufacturing apparatus further includes, on the rectifying plate, first control means that can control the amount of the first process gas. |
