发明名称 発光素子用パッケージ及びそれを用いた発光装置
摘要 This package for light emitting elements is provided with a mounting board, a reflector and a cover. The cover is bonded to the mounting board, while covering the reflector. The mounting board is provided with a metal plate, an electrically insulating layer, a hole formed in the electrically insulating layer, a first conductor layer, and a sub-mount member. The sub-mount member is provided with a base and a second conductor layer. The first conductor layer has a first terminal part in the projection region of the reflector, while having a second terminal part outside the cover. The second conductor layer has a wiring part that extends across from the mounting region to the projection region of the reflector on the mounting board. With respect to the mounting board, the wiring part and the first terminal part are electrically connected to each other via a wire.
申请公布号 JP6048880(B2) 申请公布日期 2016.12.21
申请号 JP20130012369 申请日期 2013.01.25
申请人 パナソニックIPマネジメント株式会社 发明人 林 真太郎;松岡 耕一朗;井場 拓巳;福島 博司
分类号 H01L33/60 主分类号 H01L33/60
代理机构 代理人
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