发明名称 熱硬化性樹脂組成物
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in chemical resistance after calcination, and further excellent in surface smoothness, heat resistance, adhesive property to a ground substrate such as a glass, and transparency.SOLUTION: A resin composition contains polyester amide acid obtained by a reaction of tetracarboxylic acid dianhydride, diamine and a compound containing a polyhydric hydroxy compound, and a polymer (A) obtained by radical copolymerizing an epoxy resin containing 3 to 20 epoxy groups per a molecule and having a weight average molecular weight of less than 5,000, and radical polymerizable compound represented by the general formula (3) (a1), a radical polymerizable compound having alkoxysilyl (a2) and a radical polymerizable compound having at least one of epoxy, carboxy and hydroxyphenyl (a3) in specific amount of each. In the formula (3), Ris a hydrogen or a methyl, Rto Ris an alkyl having 1 to 5 carbon atoms, Ris an alkyl having 1 to 10 carbon atoms, m is an integer of 1 to 10 and n is an integer of 1 to 150.
申请公布号 JP6048106(B2) 申请公布日期 2016.12.21
申请号 JP20120272298 申请日期 2012.12.13
申请人 JNC株式会社 发明人 近藤 学;木村 佑希
分类号 C08L63/00;C08G59/32;C08L33/14;C08L77/12;H01L31/02;H01L33/56 主分类号 C08L63/00
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