| 摘要 |
PROBLEM TO BE SOLVED: To provide: a semiconductor element adhesion silicone resin composition that has a high adhesiveness and high light transmitting property when the resin composition is pressed by a light-emitting diode (LED) chip and cured, that is excellent in heat resistance and light resistance, and that is excellent in easiness to be applied; and a silicon-containing cured product using the semiconductor element adhesion silicone resin composition.SOLUTION: There is provided the semiconductor element adhesion silicone resin composition that contains: a resin component composed of a silicone compound (A) obtained by hydrosilylizing a cyclic siloxane compound (a1) and an alicyclic unsaturated compound (a2) having vinyloxy group or allyloxy group, a cyclic siloxane compound (B) having vinyl group, and a hydrosilylation catalyst (C); and an inorganic filler (D). In the semiconductor element adhesion silicone resin composition, the inorganic filler (D) is a mixture of one or more of inorganic particle (d1) selected from among silicon fluoride, magnesium oxide, aluminum oxide, silicon dioxide, titanium oxide or zirconium oxide, and a hydrophobically treated product of the inorganic particle, the content of inorganic filler (D), assuming the total sum of (A) component, (B) component and (C) component to be 100 pts.wt., is 0.1 to 40 pts.wt., and the percentage of inorganic particle (d2) is 20 to 80 wt.% of inorganic filler (D). |
